The advancement of large-scale AI models has sparked a significant surge in the demand for computing power, consequently boosting chip power consumption and density. Amidst this evolution, liquid cooling technology is emerging as the predominant choice, gradually supplanting air cooling, thanks to its superior heat dissipation efficiency and higher deployment density. Market projections indicate that the global AI liquid cooling market will hit $8.6 billion by 2026. Among the various liquid cooling solutions, the cold plate technology stands out as the most mature option currently available, primarily due to its minimal impact on equipment and data centers, coupled with its exceptional heat dissipation performance. It is anticipated that China's liquid cooling server market will witness a 67% growth in scale by 2024.
