A research team from Tokyo University of Science in Japan has developed a novel semiconductor integration platform, BBCube, for AI systems. This platform integrates three technologies: high-density chip mounting, bump-less chip interconnection, and multi-scale thermal analysis. It enhances the integration density and data transmission capabilities of AI chips, reduces thermal resistance, and improves heat dissipation, offering a new solution for high-performance, low-energy AI accelerators and high-performance computing systems. The related achievements have been announced at the 76th IEEE Electronic Components and Technology Conference and the IEEE/JSAP Symposium on VLSI Technology and Circuits in 2026.