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Apple Unveils Its In-House AI Server Chip, Baltra, and Secures Direct Supply of Samsung’s Glass Substrates
1 day ago /
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Author：小编
Apple is intensifying its efforts in developing AI hardware in-house and has commenced testing cutting-edge glass substrates for its AI server chip, internally codenamed "Baltra". This chip is anticipated to leverage TSMC's advanced 3-nanometer N3E manufacturing process and incorporate a chiplet architecture. Opting for a closed research and development approach, Apple has chosen to directly procure glass substrates from Samsung Electro-Mechanics, thereby strengthening its grip on the supply chain. The chip communication technology is being developed by Broadcom, while TSMC will oversee the final production and packaging stages.
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