Based on TrendForce's most recent research on the high-speed interconnect market, NVIDIA's upcoming AI computing cabinet architecture suggests a significant shift in GPU design towards prioritizing high-density chip interconnectivity and rapid data transmission. The focus will increasingly be on both intra-cabinet chip interconnectivity (Scale-Up) and extensive cross-cabinet interconnectivity (Scale-Out) as central elements in data center planning. Given the physical limitations of traditional copper cable-based electrical transmission methods, which struggle to accommodate the demands of massive data transfers, there emerges a promising avenue for the advancement of optical transmission solutions. TrendForce predicts that the adoption rate of CPO (Co-Packaged Optics) within optical communication modules tailored for AI data centers will experience a steady annual increase, potentially climbing to 35% by the year 2030.