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On June 11, CoreLink Integrated Circuit, China's fourth-largest wafer foundry, revealed plans to collaboratively set up a 12-inch automotive-grade digital-analog hybrid chip production line in Shaoxing, Zhejiang Province. This facility is designed to have a monthly production capacity of 50,000 wafers. The total investment for this ambitious project amounts to 20 billion yuan, with CoreLink Integrated Circuit contributing 3.012 billion yuan. The project will focus on the production of 40/28nm MCU/DSP, 90/55nm BCD/DrMOS analog circuits, and 55nm silicon photonics/laser driver chips. The strategic aim is to optimize the semiconductor industry chain layout, bolster core competitiveness, and penetrate high-growth sectors such as AI server power management and optical interconnects.
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