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Ming-Chi Kuo: CoPoS Set for Mass Production in Late 2028, Glass and ABF to Coexist Rather Than Substitute
2026-06-11 /
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Author：小编
On June 11, renowned analyst Ming-Chi Kuo announced that TSMC's cutting-edge advanced packaging technology, CoPoS, is slated to commence mass production in the latter half of 2028. According to research findings, glass materials are not poised to replace ABF (Ajinomoto Build-up Film) in this context. The chip interconnection functionality is a collaborative effort, achieved through the redistribution layer (RDL) on the chip surface, the glass via/copper interconnection architecture embedded within the glass substrate, and the ABF build-up layer. Consequently, glass and ABF film will coexist in a complementary manner, rather than serving as substitutes for one another.
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