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Ming-Chi Kuo: CoPoS Set to Commence Mass Production in the Latter Half of 2028, with No Substitutive Interaction Between Glass and ABF
2026-06-11 /
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Author：小编
Renowned analyst Ming-Chi Kuo has announced that TSMC's cutting-edge advanced packaging technology, CoPoS, is projected to embark on mass production during the latter half of 2028. According to research findings, glass materials are not poised to supplant ABF films. Instead, the chip interconnection functionality will be realized collaboratively through the redistribution layer on the chip side, glass vias and copper interconnection structures embedded within the glass substrate, as well as ABF build-up layers. Consequently, glass and ABF films are expected to coexist harmoniously, without any substitutive interaction between them.
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