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As per the announcement on SK Hynix's official website, on Wednesday, Chey Tae-won, the Chairman of SK Group, held a meeting with Wei Zhejia, the Chairman of TSMC. During the meeting, both parties engaged in discussions regarding the most recent advancements in next-generation artificial intelligence technologies. They reached an agreement to further intensify their cooperation in the research and development of next-generation High Bandwidth Memory (HBM) and advanced packaging technologies. Looking ahead, the two companies are set to expedite their respective endeavors to bolster their competitive edge in the customized AI memory market and cater to the escalating and varied demands of global large-scale technology company clients. By collaborating with TSMC, SK Hynix is poised to promptly introduce high-performance products to the market.
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