Peng Lianmao and Jiang Jianfeng of Peking University’s School of Electronics, Together with 59 Domestic and International Scholars, Propose a Cross-Layer Collaborative Development Path for Next-Genera
18 hour ago / Read about 0 minute
Author:小编   

Artificial intelligence (AI) is rapidly transitioning from the digital realm into the physical world. Autonomous systems, such as intelligent connected vehicles, embodied robots, and low-altitude aircraft, are now expected to perform real-time perception, reasoning, decision-making, and control tasks—all while adhering to stringent constraints on power consumption, storage capacity, and environmental conditions. As the foundational support for these systems, intelligent chips are crucial for ensuring their safe and reliable operation. The Opinions on Deepening the Implementation of the ‘AI Plus’ Initiative, issued by the State Council, explicitly calls for the vigorous development of next-generation intelligent terminals, including intelligent connected vehicles and intelligent robots, and promotes the integration of AI with technologies such as low-altitude flight. The development of high-performance, energy-efficient, and highly reliable intelligent chips represents the cornerstone for AI to empower the real economy and foster new quality productive forces.

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