On April 15, 2026, Black Sesame Technologies made an announcement that the Tianyuan Intelligent Cockpit Plus, an integrated cockpit and driving mass-production platform developed by Dongfeng Motor, would be powered by its Wudang C1296 chip. This marks a significant platform-level collaboration between the two entities. Leveraging a single chip, this platform is designed to concurrently support intelligent cockpit functionalities, L2+ driving assistance, and FAPA (Fully Automated Parking Assist) parking capabilities. The platform will make its debut in the Dongfeng eπ007 model and is slated for mass production across a variety of vehicle models from 2026 to 2027. The C1296 chip, built on a 7nm automotive-grade process, facilitates hardware-level integration across four domains. It transcends traditional functional domain barriers, optimizes resource utilization, and ultimately reduces costs.