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Honor Granted Patent for 'Software Configuration Method and Related Devices'
13 hour ago /
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Author：小编
According to Tianyancha, Honor Device Co., Ltd. obtained a patent named 'Software Configuration Method and Related Devices' on October 17, 2025, with the authorization announcement number CN119271256B. The patent application was filed on January 26, 2024. This patent determines the SDK universal build script by acquiring the device form, feature set, and chip platform information of IoT devices. The built SDK is integrated with third-party devices in the form of a configurable static library, ensuring the security of internal communication protocols and users' private data.
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