According to a leak from blogger Digital Chat Station, the screen design of the upcoming iPhone 18 Pro series is poised for a significant alteration. Apple is currently in the testing phase of a unique HIAA (High-Aspect-Ratio Active Area) hole-punch solution, which could potentially downsize the Dynamic Island feature that has been a staple of iPhones for several years. Unlike the common single-hole punch design prevalent in Android devices, the HIAA hole-punch boasts a smaller footprint than Apple's existing Dynamic Island.

Furthermore, the iPhone 18 Pro series is rumored to incorporate the A20 Pro chip, which will be manufactured using TSMC's cutting-edge 2nm process. This marks a notable advancement in chip technology for Apple. Additionally, for the first time, the series is expected to feature Apple's self-developed C2 baseband chip, enhancing its connectivity capabilities.

In a bold move, the iPhone 18 Pro series might also introduce a foldable model, which is slated to be unveiled concurrently with the standard 18 Pro, offering consumers a fresh and innovative option in the smartphone market.