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Semiconductor Titans Embark on Bold Moves into Panel-Level Packaging, Sparking Fresh Order Battles
3 day ago /
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Author：小编
Fan-out panel-level packaging stands as the next frontier in advanced packaging technology, commanding significant industry interest. Leading the charge are TSMC, a colossal wafer foundry; ASE, a pioneer in semiconductor packaging and testing; and Powertech, a dominant force in memory packaging and testing. All three have strategically positioned themselves to capitalize on the surging demand for highly integrated advanced packaging solutions in the high-performance computing chip market, fueled by major players like NVIDIA and AMD. Through relentless technological innovation and capacity augmentation, these titans are vying for a greater share of the market.
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