Officially Stepping into the Laser Processing Arena: Hisense Launches New Venture, Hiplin
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Author:小编   

On June 24th, Hisense orchestrated the grand unveiling ceremony for Hiplin in Tianjin. This momentous occasion signifies a pivotal advancement in Hisense's pursuit within the laser industry, representing a decisive leap forward in fostering the vertical integration of the laser industry supply chain. Capitalizing on this strategic juncture, Hisense's laser division is set to broaden its horizons from consumer-oriented display technologies to encompass industrial-grade, high-end manufacturing solutions. The company is poised to penetrate three rapidly expanding sectors: semiconductor lasers, fiber lasers, and ultrafast lasers. Looking ahead, Hisense is committed to concentrating on core domains such as laser displays, processing techniques, light sources, and essential components, with the aim of broadening industrial applications and amplifying its global footprint.