Decom Engineering’s Subsea Cutting Tech Wins US Patent
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Author:小编   

On April 8, 2026, Decom Engineering, a subsea technology firm headquartered in Aberdeen, secured a US patent for critical components of its Chopsaw cutting technology. These components encompass a linear drive cutting system, modular drive units, and a versatile clamping mechanism, further cementing the company’s dominance in both subsea and onshore cutting markets. The Chopsaw technology incorporates a linear drive cutting head that advances the blade through materials with precision-controlled linear motion, substantially improving cutting accuracy, consistency, and control.

The modular drive system enables swift on-site replacement or reconfiguration, while the adaptable clamping mechanism allows a single saw to cut a diverse array of materials, diameters, and structural types. Specifically engineered to slice through materials such as carbon steel, duplex steel, and coated structures, the C1 series cutting saws can process materials with diameters up to 46 inches. Nick McNally, Managing Director of Decom Engineering, emphasized that the patent is vital for preserving the company’s competitive edge in the cutting industry and safeguarding its intellectual property on the global stage.