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On September 23rd, AAC Technologies made an announcement via its official WeChat account, revealing that it has entered into a partnership with Intel to establish a liquid cooling ecosystem. The two companies will work hand in hand to propel the progress of liquid cooling technologies tailored for high-density servers and rack-level architectures. This collaborative effort encompasses the development of core components for liquid cooling, system-level solutions, and the enhancement of validation capabilities. Specifically, the scope of cooperation includes CPU cold plates, liquid cooling technologies for memory and SSDs, UQD/QD quick-connect fittings, manifolds, CDUs (Coolant Distribution Units), as well as comprehensive liquid cooling solutions for both individual system nodes and entire rack-level setups.
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