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At a juncture where the burgeoning artificial intelligence sector is propelling a surge in electricity demand within data centers, a research contingent from the University of Illinois Urbana-Champaign in the United States has unveiled a groundbreaking three-dimensional printing technique tailored for pure copper cooling plates. This innovative approach is poised to dramatically curtail the energy expended on cooling operations in data centers, potentially trimming the current proportion of total electricity consumption—currently hovering around 30%—down to a mere 1.1%. According to the researchers' projections, should this technology be fully integrated into hyperscale data centers, the overall energy consumption dedicated to cooling could plummet by more than 90%, inching closer to the theoretical limits of thermal engineering efficiency.
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