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Multiple credible sources have verified that Sugon is on the verge of unveiling a cutting-edge, next-generation holistic infrastructure solution tailored specifically for intelligent computing centers. This innovative solution pioneers the large-scale utilization of diamond alloy materials within China, marking a significant breakthrough in addressing the challenge of cooling systems with ultra-high heat flux density. By doing so, it paves the way for a comprehensive enhancement of the Power Usage Effectiveness (PUE) metric in data centers. Notably, pivotal performance indicators, including power density per cabinet, are anticipated to surpass and achieve NVIDIA's ambitious 2028 Feynman architecture targets well ahead of the projected timeline.
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