Recently, industry collaborators including Moore Threads, China Mobile Research Institute, and Zhejiang Lab, leveraging the OISA Collaborative Innovation Platform, have officially rolled out the 'Technical Specification for OISA High-Density Super-Node Reference Design.' This specification is tailored to tackle the interconnection bottlenecks, power supply, and cooling challenges prevalent in intelligent computing centers. It puts forward a comprehensive, full-stack solution that dismantles conventional barriers to computing power expansion by redefining spatial density and scalability dimensions.

The technical specification presents a large-scale, high-density cabling solution, facilitating complete interconnection of 128 cards within a standard single-width cabinet. This is achieved through interconnections ranging from 32 to 64 cards and also supports parallel cabinet expansion to accommodate a 256-card deployment. Such an approach markedly boosts the computing power output per unit of land area, representing a significant leap forward in the field.