Baidu Intelligent Cloud has unveiled an integrated cloud-and-AI solution tailored for the consumer electronics sector. This all-encompassing offering spans chips, frameworks, and platforms, and has established a full-stack AI infrastructure. This infrastructure incorporates both AI Infra and Agent Infra components, specifically designed to facilitate mass production. At the AI Infra tier, the solution significantly boosts computing capabilities by harnessing the power of the Kunlun Core and the Baidu Baige AI Computing Platform. Meanwhile, at the Agent Infra tier, it leverages the Qianfan Platform to address the challenge of redundant development faced by enterprises. By doing so, it provides the consumer electronics industry with comprehensive engineering support throughout the entire process. This support encompasses model invocation, deployment, toolchains, and knowledge enhancement.