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LG Electronics and Flex Ltd. Forge Partnership to Co-Develop Integrated Modular Cooling Solutions
1 week ago /
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Author：小编
On November 4, LG Electronics inked a memorandum of understanding with Flex Ltd., a renowned global electronics manufacturing services provider. The aim is to collaboratively develop integrated modular cooling solutions tailored to tackle the thermal management hurdles faced by data centers in the age of artificial intelligence. By amalgamating the technological prowess of both entities, this solution is designed to offer flexible customization and scalability. It is poised to facilitate the swift deployment of high-density AI workloads, catering to the evolving needs of modern data centers.
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