Innolux Initiates Mass Production of FOPLP, Shipping 2 Million Units Monthly
2 week ago / Read about 0 minute
Author:小编   

At the legal conference, Innolux Chairman Hong Jinyang announced that the company has commenced shipments of its Fan-Out Panel Level Packaging (FOPLP) Chip-First products in the previous quarter, initially reaching millions of units per month. By the end of the year, Innolux aims to significantly ramp up production, targeting monthly shipments in the tens of millions of units.