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Zhongxin Wafer Receives Patent for 'Processing Technology to Enhance Silicon Wafer Backside Sealing Aesthetics'
3 week ago /
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Author：小编
Hangzhou Zhongxin Wafer Semiconductor Co., Ltd. has successfully secured the publication of its patent for 'Processing Technology to Enhance Silicon Wafer Backside Sealing Aesthetics'. The patent, bearing the application publication number CN119615104A, was officially published on March 14, 2025. This innovative technology falls within the realm of silicon wafer processing and is designed to boost the yield of single-pass processed products through the meticulous optimization of process parameters.
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