Samsung Electronics to Gradually Implement Hybrid Bonding Technology, Commencing with 16-Layer HBM

8 hour ago / Read about 0 minute

Author：小编

Samsung Electronics intends to integrate hybrid bonding technology beginning with the 16th-layer High Bandwidth Memory (HBM), with the objective of surmounting the technical hurdles posed by the escalating number of layers. This innovative approach not only dramatically diminishes the thickness of HBM but also bolsters its heat dissipation capabilities. The forthcoming seventh-generation HBM4E will serve as a testbed for this technology, paving the way for widespread adoption in the eighth-generation HBM5. Furthermore, ROHM Semiconductor has unveiled an ultra-compact CMOS operational amplifier, propelling the semiconductor industry towards unprecedented levels of performance and miniaturization.

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