Xinde Semiconductor Secures Nearly 400 Million Yuan in Funding, Bolstering Domestic Advanced Packaging and Testing R&D

1 week ago / Read about 0 minute

Author：小编

Xinde Semiconductor has recently concluded a successful funding round, co-led by municipal and district-level institutions, with additional investments from Yuanhe Puhua, the Provincial Strategic Emerging Industries Investment Fund, and Yushan Capital. This round raised approximately 400 million yuan. The proceeds will primarily be allocated to expedite the research, development, and production of cutting-edge packaging and testing technologies, including SiP (System-in-Package), FOWLP (Fan-Out Wafer-Level Packaging), Chiplet-2.5D/3D, and heterogeneous packaging modules.

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