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Microvision Intelligence Receives Patent Authorization for 'A Die Bonder and Die Bonding Method'
1 day ago /
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Author：小编
Microvision Intelligence Packaging Technology (Shenzhen) Co., Ltd. has recently been granted a patent, titled 'A Die Bonder and Die Bonding Method,' with authorization announcement number CN119626968B. This patent was filed on February 10, 2025, and was officially announced on June 13, 2025. Established in 2019, Microvision Intelligence Packaging Technology (Shenzhen) Co., Ltd. specializes in the manufacture of specialized equipment. The acquisition of this patent further solidifies the company's position as a leader in semiconductor packaging technology.
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