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Nikon Introduces 600x600mm Substrate for Cutting-Edge AI Chips
3 day ago /
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Author：小编
Nikon has announced the commencement of orders for the DSP-100, an innovative digital lithography system meticulously crafted to serve as a backend tool for the next generation of advanced semiconductor packaging. The initial batch of these sophisticated devices is anticipated to be delivered during the fiscal year 2026. Tailored specifically for Panel-Level Packaging (PLP) technology, the DSP-100 addresses the escalating costs and space constraints associated with 300mm wafers, a challenge embraced by industry titans like TSMC, Intel, and Samsung.
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