TSMC is expediting the construction of two new fabs in Arizona, USA. The Fab P2, targeted for 3nm process technology, is set to commence mass production in the latter half of 2027. Meanwhile, Fab P3, anticipated to finalize contracting by the end of 2025, will focus on producing 2nm and more cutting-edge chips. This initiative is poised to significantly reduce the technology gap between the United States and Taiwan in advanced chip manufacturing, carrying substantial strategic importance for the U.S. semiconductor industry.