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【Patent】Leuven Instruments Announces Patent for "Etching Method for Film Layer on Surface of Open Sidewall",
5 day ago /
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Author：小编
Jiangsu Leuven Instruments Co., Ltd. has announced a patent titled "Etching Method for Film Layer on Surface of Open Sidewall", with the application publication number of CN119626902A and a publication date of March 14, 2025. This method is applied in semiconductor devices, achieving precise control over etching locations by accurately controlling the incidence angle of the ion beam, thereby enhancing etching accuracy.
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