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Japanese Chipmaker Kioxia Debuts with $2.2 Billion Bond Issuance
1 day ago /
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Author：小编
For the first time, Japanese chipmaker Kioxia has successfully issued $2.2 billion in high-yield bonds in the US. The proceeds from this issuance will be utilized for repurchasing preferred shares and for general corporate purposes, positioning Kioxia as the latest Japanese firm to leverage overseas credit markets.
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