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LG Electronics Commences Development of Hybrid Bonding Equipment, Targeting Mass Production by 2028
2 day ago /
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Author：小编
LG Electronics' Production Technology Research Institute has embarked on the development of hybrid bonding equipment, with the ambition to achieve mass production by 2028. This advanced technology leverages bump-less copper-to-copper bonding, aiming to create HBM (High Bandwidth Memory) memory stacks exceeding 16 layers. By minimizing the space between DRAM chips, it significantly increases the number of stack layers and mitigates heat generation.
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