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Hongxin Electronics Announces Plan to Issue Up to 500 Million Yuan in Science and Technology Innovation Bonds
1 day ago /
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Author：小编
The board of directors of Hongxin Electronics has authorized the issuance of science and technology innovation bonds, with a proposed maximum value of 500 million yuan and a duration of up to three years. The exact terms and conditions of the issuance will be finalized in accordance with prevailing market conditions. This move aims to refine the company's debt structure, mitigate financial risks, and facilitate the expansion of its production scale.
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