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ESWIN Unveils Patent for 'Advanced Wafer Polishing Technique and Resultant Products'
5 day ago /
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Author：小编
Xi'an ESWIN Material Technology Co., Ltd. proudly announces the acquisition of a patent for an 'Advanced Wafer Polishing Technique and Resultant Products,' bearing the application publication number CN119609906A and published on March 14, 2025. This groundbreaking patent introduces a two-stage polishing process that effectively mitigates the risk of wafer flatness degradation, thereby boosting polishing efficiency and paving the way for innovative technological advancements within the semiconductor industry.
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