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Publication of Leuven Instruments' Patent: "Method for Etching Film Layers on Opening Sidewalls"
4 day ago /
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Author：小编
On March 14, 2025, Jiangsu Leuven Instruments Co., Ltd. saw the publication of their patent application titled "A method for etching a film layer on the surface of an opening sidewall," bearing the publication number CN119626902A. This innovative method is poised to revolutionize semiconductor processing through its precision etching technology, ultimately enhancing device performance.
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