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Taiwan Semiconductor Manufacturing Company's (TSMC) Arizona facility has successfully manufactured the initial batch of chips destined for technology giants including Apple, NVIDIA, and AMD. Nonetheless, owing to the insufficient local packaging capabilities, these chips must undergo air transportation back to Taiwan for the packaging process before being distributed to AI server manufacturers. Despite the incremental cost associated with this arrangement, all involved parties remain unperturbed, given the robust demand within the AI market. This scenario highlights the existing gaps in the U.S. chip supply chain. Nonetheless, the U.S. is progressively striving towards chip self-sufficiency through investments in factory construction and other initiatives, aiming to fulfill over 50% of domestic chip demand by 2032.
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