【IPO frontline】Xinqiang Electronics' IPO application on the ChiNext board has been accepted, raising 962 million yuan to invest in the expansion and renovation project of high-multi-layer high-density - Chip

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【IPO frontline】Xinqiang Electronics' IPO application on the ChiNext board has been accepted, raising 962 million yuan to invest in the expansion and renovation project of high-multi-layer high-density

1 day ago / Read about 0 minute

Author：小编

On June 30, the Shenzhen Stock Exchange officially accepted Xinqiang Electronics' IPO application on the ChiNext board. The company plans to issue no less than 51 million new shares and raise about 962 million yuan to invest in the expansion and renovation project of high-multi-layer high-density interconnect printed circuit boards.

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