Zhejiang Jingsheng Electromechanical Adjusts Projects: Polishing Equipment Manufacturing Terminated, 12-Inch Silicon Wafer Project Delayed to June 2027
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Author:小编   

On June 28, 2025, Zhejiang Jingsheng Electromechanical Co., Ltd. (Jingsheng Electromechanical) announced significant adjustments to certain fund-raising initiatives. The company has decided to discontinue the "Annual Production of 80 Sets of Semiconductor Material Polishing and Thinning Equipment Manufacturing Project," with the remaining raised funds to be deposited into a dedicated management account. Concurrently, the anticipated date for the readiness of the "12-Inch Integrated Circuit Large Silicon Wafer Equipment Testing Pilot Line Project" has been shifted to June 30, 2027.