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On the 24th of this month, Intel hosted its inaugural Direct Connect Asia foundry event in Seoul, marking its first such event held outside the United States. The gathering drew the attention of renowned firms such as Arm, Cadence, Synopsys, and Rambus, several of which currently rely on Samsung, TSMC, or UMC for their manufacturing needs. This milestone signifies a strategic move by Intel to court Samsung's clientele and broaden its supply chain base. Additionally, both SK Hynix and Samsung are contemplating the adoption of Intel's foundry services for the production of HBM4 memory base chips, a move aimed at leveraging Intel's advanced packaging solutions to attract a wider customer base. Despite TSMC's commanding position in the foundry market, Intel remains resolute in its efforts to expand its market share.
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