Micron's Strategic Advancements in the HBM Market: Robust Financial Performance and Powertech Lands Major Contract

2 week ago / Read about 0 minute

Author：小编

Micron Technology has unveiled an impressive financial report for the past quarter, accompanied by a promising forecast for the current quarter, further solidifying its presence in the High Bandwidth Memory (HBM) market. This growth has spurred a notable increase in demand for its backend outsourced semiconductor assembly and test (OSAT) services. In a significant move, Micron has delegated a substantial portion of its HBM2 packaging operations to Taiwan-based OSAT provider Powertech Technology, who has exclusively secured a major contract related to these services.

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