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Publication of JCET Technology's Patent for 'Semiconductor Packaging Structure and Formation Method'
2 week ago /
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Author：小编
On March 14, 2025, Jiangsu Changjiang Electronic Technology Co., Ltd. officially published its patent for the 'Semiconductor Packaging Structure and Formation Method' with application publication number CN119626913A. This patent, rooted in the realm of chip packaging technology, introduces innovative methods to refine the packaging structure, thereby enhancing its technical capabilities.
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