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Fengtao Technology Unveils Active Cooling Chip for Smartphones, Elevating Cooling Efficiency by 15%
1 day ago /
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Author：小编
Amidst the 5G+AI era, computational power has soared, accompanied by a corresponding escalation in chip heat production alongside performance boosts. Challenges like frequency throttling, accelerated device aging, and compromised user experience due to excessive heat have surfaced, rendering traditional passive cooling techniques inadequate to address the computational demands of modern mobile devices. Fengtao Technology (stock code: 688279) has introduced the FT3207, a fully integrated active cooling chip tailored for smartphones, which redefines cooling benchmarks through three groundbreaking innovations.
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