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Intel is aggressively pursuing its foundry strategy, earmarking a staggering $90 billion for the development of the groundbreaking 18A process (1.8nm) technology. This advanced process incorporates two innovative features: RibbonFET and PowerVia. Despite these advancements, Intel confronts formidable hurdles: the company incurred a loss of $13 billion last year, witnessed a near-50% plunge in its share price, and the yield of its 18A process currently stands at a modest 20%-30%. In stark contrast, its rival TSMC dominates two-thirds of the global market share, boasts a robust 60% yield for its 2nm process, and aims to commence mass production by 2025. Furthermore, TSMC's loyal customer base, which includes industry giants like Apple and AMD, underscores its clear edge in the race for cutting-edge process technology.
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