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Taiwan Semiconductor Manufacturing Company's (TSMC) Arizona factory in the United States has commenced production of the initial batch of chip wafers destined for companies like Apple and NVIDIA. However, the hub for advanced packaging technology continues to be Taiwan. NVIDIA's Graphics Processing Units (GPUs) necessitate being shipped back to Taiwan for packaging, prompting TSMC to contemplate the construction of two advanced packaging facilities in the United States. In the global chip landscape, advanced packaging technology has emerged as a pivotal area, with high-precision packaging techniques such as CoWoS and Foveros capturing significant attention. According to reports, Apple's A20 chip will employ a 2-nanometer process and WMCM packaging technology, with TSMC's associated production line anticipated to achieve a monthly capacity of 50,000 units by the end of 2026.
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