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Huawei Unveils Patent for Innovative 'Quad-Chiplet Packaging' Technology
19 hour ago /
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Author：小编
Huawei has recently submitted a patent application for a pioneering 'quad-chiplet' packaging design, envisioned for integration into its next-generation AI chip, the Ascend 910D. While this design bears a resemblance to NVIDIA's Rubin Ultra architecture, Huawei remains steadfast in its pursuit of developing proprietary, cutting-edge packaging technologies. Should this patent be successfully implemented, Huawei is poised to rival industry leaders in this domain.
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