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Apple's A20 Chipset Slated for iPhone 18 Pro Series and Foldable Models, Leveraging TSMC's 2nm WMCM Packaging Technology
2 day ago /
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Author：小编
TSMC has commenced taking orders for 2nm wafers, anticipating the initial batch of chipsets utilizing this groundbreaking technology to debut in the market by the end of the following year. Apple is poised to be among the pioneers in adopting this technology, with whispers indicating that its A20 chip will undergo mass production employing the 2nm process. This advancement promises to markedly enhance chip performance while minimizing power consumption.
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