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AMD MI350 Integrates Samsung Electronics and Micron's High-Bandwidth Memory
2 day ago /
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Author：小编
On June 13, AMD revealed that its Instinct MI350 series incorporates HBM (High-Bandwidth Memory) products sourced from Samsung Electronics and Micron. This series boasts 8 36GB HBM3E memory modules, arranged in a 12Hi stack configuration with a data transfer rate of 8Gbps. This arrangement delivers a total memory capacity of up to 288GB and a bandwidth of 8TB/s, offering robust memory and bandwidth capabilities essential for AI acceleration.
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