CITIC Securities: Rising Demand for Component Thermal Management, Emphasizing Heat Dissipation at the Source
1 week ago / Read about 0 minute
Author:小编   

According to CITIC Securities, the ongoing enhancement of 5G mobile phone performance and internal functional components is anticipated to propel the heat dissipation application market into further expansion. Laptops employ a blend of thermal interface materials, graphite films, heat pipes, cooling fans, and other advanced heat dissipation solutions to meet the dual demands of high performance and sleek design. In the realm of new energy, the stringent heat dissipation requirements of power batteries have led to the adoption of liquid cooling technology as the current premier heat dissipation approach. With the increasing prevalence of new energy vehicles, high-rate fast charging technology confronts significant heat dissipation challenges. High-end models have already entered the era of 5C-6C fast charging, necessitating heightened standards for battery safety and optimized heat dissipation. Collectively, the markets for liquid cooling and liquid cooling ultra-fast charging in power batteries exhibit immense potential for growth.