Jiawate's Patent on 'Electrical Isolation Structure, Manufacturing Method, and Multi-Chip Packaging Structure' Officially Published - Chip

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Jiawate's Patent on 'Electrical Isolation Structure, Manufacturing Method, and Multi-Chip Packaging Structure' Officially Published

1 week ago / Read about 0 minute

Author：小编

Jiawate Microelectronics Co., Ltd. has successfully published a patent titled 'Electrical Isolation Structure, Its Manufacturing Method, and Multi-Chip Packaging Structure', bearing the application publication number CN119447115A. This significant achievement was announced on February 14, 2025.

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