NXP Semiconductors has outlined plans to phase out four 8-inch wafer fabs over the next decade, encompassing one facility in Nijmegen, Netherlands, and three in the United States. This strategic shift is geared towards transitioning to more advanced 12-inch fabs, aiming to lower costs and bolster profitability. To this end, NXP has already established a joint venture with World Advanced Semiconductor in Singapore, with the goal of constructing a 12-inch wafer fab. Mass production from this facility is anticipated to commence in 2027.
While Nijmegen, a crucial operational hub for NXP, will be impacted by this decision, the company is committed to ensuring a seamless transition for all stakeholders involved.