Search
TSMC's Jiayi Advanced Packaging Plant May Face "Delays": Industry Observes Potential Impact on Global HPC Chip Supply
3 day ago /
Read about 0 minute
Author：小编
Amidst its vigorous expansion of advanced packaging capabilities, TSMC has reportedly encountered a delay in the construction of its Jiayi Advanced Packaging Plant (AP7). Originally anticipated to commence equipment installation in the third quarter, the supply chain has recently been informed that this milestone has been rescheduled to the fourth quarter. Furthermore, two recent industrial safety incidents at the Jiayi facility have necessitated temporary work stoppages, raising concerns about potential setbacks in the plant's construction timeline and, consequently, the global supply of high-performance computing (HPC) chips.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
